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Features
Buffered memory type Unregistered (unbuffered)
CAS latency 11
Internal memory 4 GB
Memory layout (modules x size) 1 x 4 GB
Internal memory type DDR3
Memory data transfer rate 1600 MT/s
Component for Laptop
Memory form factor 204-pin SO-DIMM
ECC No
Memory bus 64 bit
Memory ranking 1
Memory voltage 1.5 V
Module configuration 512M X 64
Row cycle time 48.125 ns
Refresh row cycle time 260 ns
Row active time 35 ns
Country of origin Taiwan
Lead plating Gold
Operational conditions
Operating temperature (T-T) 0 - 85 °C
Storage temperature (T-T) -55 - 100 °C
Weight & dimensions
Width 67.6 mm
Height 30 mm
Packaging data
Package type SO-DIMM
Logistics data
Harmonized System (HS) code 84733020
Other features
Chips organisation X8
Bus clock rate 1600 MHz
Error indication No
Memory layout 1 x 4096 MB
Internal memory 4096 MB

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