Heat Sink Compound Thermal Paste 1.5g Silver 1.93 W/m·K
Heat Sink Compound Thermal Paste 1.5g Silver 1.93 W/m·K
Improve your CPU cooling efficiency with this high-performance heat sink compound. Ideal for gamers and professionals who need reliable thermal management.
This StarTech.com thermal paste is designed to provide optimal heat conductivity for your CPU, ensuring stable performance even under heavy loads.
- Type: Metal Oxide Compound
- Packaging: Re-sealable Syringe (1.5g)
- Thermal Conductivity: 1.93 W/m·K
- Thermal Resistance: 0.12 °C/W
- Density: 1.7 g/cm³
- Temperature Range: -30 to 180 °C
Available stock: 60
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Estimated delivery: May 31 - Jun 04
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| Features | |
|---|---|
| Type | Thermal paste |
| Thermal conductivity | 1.93 W/m·K |
| Product colour | Silver |
| Thermal resistance | 0.12 °C/W |
| Specific gravity | 1.7 g/cm³ |
| Operating temperature (T-T) | -30 - 180 °C |
| Technical details | |
| Evaporation (@ 200°C/24h) | 0.001% |
| Bleed (@ 200°C/24h) | 0.05% |
| Compliance certificates | RoHS |
| Weight & dimensions | |
| Width | 20 mm |
| Depth | 67 mm |
| Weight | 4 g |
| Packaging data | |
| Package width | 84 mm |
| Package depth | 151 mm |
| Package height | 25 mm |
| Package weight | 17 g |
| Logistics data | |
| Master (outer) case width | 330 mm |
| Master (outer) case length | 430 mm |
| Master (outer) case height | 330 mm |
| Products per master (outer) case | 230 pc(s) |

