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Features
Buffered memory type Unregistered (unbuffered)
On-Die ECC Yes
CAS latency 40
Internal memory 64 GB
Memory layout (modules x size) 2 x 32 GB
Internal memory type DDR5
Memory data transfer rate 5600 MT/s
Component for Laptop
Memory form factor 262-pin SO-DIMM
ECC No
Memory ranking 2
Memory voltage 1.1 V
Module configuration 4096M x 64
Row cycle time 48 ns
Refresh row cycle time 295 ns
Row active time 28.56 ns
Intel Extreme Memory Profile (XMP) Yes
Intel Extreme Memory Profile (XMP) version 3.0
SPD profile Yes
Programming power voltage (VPP) 1.8 V
Country of origin China, Taiwan
Cooling type Heatsink
Lead plating Gold
JEDEC standard Yes
Operational conditions
Operating temperature (T-T) 0 - 85 °C
Storage temperature (T-T) -55 - 100 °C
Weight & dimensions
Width 3.8 mm
Depth 69.6 mm
Height 30 mm
Weight 20 g
Packaging data
Package width 95.2 mm
Package depth 14 mm
Package height 171.4 mm
Package weight 46.21 g
Logistics data
Master (outer) case width 203.2 mm
Master (outer) case length 311.1 mm
Master (outer) case height 101.6 mm
Master (outer) case gross weight 1.37 kg
Products per master (outer) case 25 pc(s)

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