Heat Sink Compound StarTech.com SILVGREASE1 1.5g Metal Oxide Thermal Paste

Informations

Re-sealable Syringe | Thermal Conductivity: 3.195 W/m-K at 25 °C or greater

This thermal paste works with a heat sink to improve heat dissipation from integrated computer chips such as CPUs. The thermal paste features CE and RoHS certifications so you can rest assured it's safe for its intended use.

Reliable Performance

This thermal paste, also known as silver grease, is a metal-based compound that contains 60% metal oxide to offer better thermal conductivity than standard heat transfer pastes. SILVGREASE1 ensures reliable performance in temperatures of -22°F to 365°F (-30°C to 180°C) with thermal conductivity of 3.195 W/m-K at 25 °C or greater. This performance makes the compound ideal for servicing & maintaining workstations, desktop computers and servers, and is best suited for CPUs with TDP of up to 65W

Reseable 1.5g Syringe Tubes

The tube contains 1.5g of paste, sufficient for 4 to 6 applications. the compound is packaged in a syringe for easy application, that's re-sealable to prevent the product from drying between use.

SILVGREASE1 is backed by a StarTech.com 2-year warranty, including free lifetime 24/5 multi-lingual, North American based, technical assistance.

The StarTech.com Advantage

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Heat Sink Compound StarTech.com SILVGREASE1 1.5g Metal Oxide Thermal Paste

Name: Heat Sink Compound StarTech.com SILVGREASE1 1.5g Metal Oxide Thermal Paste
Brand: StarTech.com
SKU: SILVGREASE1
Price: 4.06 EUR
Availability: InStock

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€4,06 EUR

€4,06 EUR ~~€4,95 EUR~~

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Computer systems that depend on optimal CPU performance benefit greatly from the StarTech.com SILVGREASE1 heat sink compound. This thermal paste excels in efficient heat dissipation, ensuring your system runs cooler and operates more efficiently.

Designed for users looking to replace aging or degraded thermal compounds, this product provides a dependable thermal interface between your CPU and heat sink. With high thermal conductivity, you can achieve improved thermal management for your hardware.

Material: Metal Oxide Compound
Weight: 1.5g, re-sealable syringe
Thermal Conductivity: 1.93 W/m·K
Thermal Resistance: 0.12 °C/W
Density: 1.7 g/cm³
Operating Temperature: -30 to 180 °C

Perfect for IT professionals and enthusiasts who need reliable thermal interfaces for CPUs and heat sinks in desktop and workstation applications.

Vendor: StarTech.com

Type: Heat Sink Compounds

Available stock: 125

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Estimated delivery: Jul 14 - Jul 18

Informations

Payment & Security

Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.

Features
Type	Thermal paste
Thermal conductivity	1.93 W/m·K
Product colour	Silver
Thermal resistance	0.12 °C/W
Specific gravity	1.7 g/cm³
Operating temperature (T-T)	-30 - 180 °C
Technical details
Evaporation (@ 200°C/24h)	0.001%
Bleed (@ 200°C/24h)	0.05%
Compliance certificates	RoHS
Weight & dimensions
Width	20 mm
Depth	67 mm
Weight	4 g
Packaging data
Package width	84 mm
Package depth	151 mm
Package height	25 mm
Package weight	17 g
Logistics data
Master (outer) case width	330 mm
Master (outer) case length	430 mm
Master (outer) case height	330 mm
Products per master (outer) case	230 pc(s)